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Produsen OEM – SLM (Pencetakan 3D Logam) Spesialis

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3D Printing Telecommunications Parts and Components Application List and DT Success Stories

Updated on 28/11/2025 By DT 3dprint
DT's Workers in Front of Our SLM Metal 3D Printers
DT’s Workers in Front of Our SLM Metal 3D Printers
The Industrial SLM Metal 3D Printers in DT Factory
The Industrial SLM Metal 3D Printers in DT Factory
DT 3D Printing Factory Core Team
DT 3D Printing Factory Core Team
The Industrial SLM Metal 3D Printers in DT Factory Work Shop
The Industrial SLM Metal 3D Printers in DT Factory Work Shop
Suku Cadang Roda Mobil Dicetak dengan Printer DT SLM 3D
Suku Cadang Roda Mobil Dicetak dengan Printer DT SLM 3D
Suku Cadang Roda Mobil Dicetak dengan Printer DT SLM 3D
Suku Cadang Roda Mobil Dicetak dengan Printer DT SLM 3D
3D-printed precision automotive mold components
3D-printed precision automotive mold components
Roda Mobil Cetak 3D Logam DT SLM 03
Roda Mobil Cetak 3D Logam DT SLM 03
Roda Mobil Cetak 3D Logam DT SLM 02
Roda Mobil Cetak 3D Logam DT SLM 02
Roda Mobil Cetak 3D Logam DT SLM 01
Roda Mobil Cetak 3D Logam DT SLM 01
The 3D Printers in a Factory DT Wholly Invested in
The 3D Printers in a Factory DT Wholly Invested in
Roda Mobil Cetak 3D Logam DT SLM 04
Roda Mobil Cetak 3D Logam DT SLM 04

3D Printing Applications in Telecommunications

Application CategorySpecific Product ExamplesKey Materials & TechnologiesPrimary Advantages
Antennas & RF Components5G/6G base station antennas (MIMO, mmWave), flexible antennas, satellite communication antennas, RF filters, antenna thermal management structuresMetals (aluminum, titanium alloys), ceramic-filled polymers, conductive compositesLightweighting, complex integrated structures, high-frequency performance optimization
Optical Communication DevicesFiber optic connector prototypes, splitter/coupler housingsHigh-precision resins (e.g., PC-like), transparent materialsRapid prototyping, customized internal optical structures
Base Station & Network EquipmentThermal management modules (heat sinks, cooling fins), equipment enclosures/shielding covers, mounting brackets/cable management componentsMetals (copper alloys, aluminum), engineering plastics (Abs, nylon)Thermal management optimization, EMI shielding, lightweighting and rapid deployment
Tooling & Indirect ManufacturingInjection molds (for enclosures/connectors), silicone molding tools (for seals), thermoforming molds (for curved panels)High-temperature resistant resins, tool steel (indirect printing)Reduced mold lead time, low-cost small-batch production
Satellite & Specialized CommunicationLightweight satellite antenna structures, waveguide components, space mission communication antennas, filter cavitiesCeramics, high-performance polymers (e.g., MENGINTIP), titanium alloysExtreme environment adaptability, high-precision customization, reduced launch costs
Prototyping & Custom ToolingFunctional prototypes (e.g., phone/wearable housings), custom jigs/fixtures (for assembly/testing)Photopolymer resins, nylon, TPRRapid iteration validation, compatibility with complex assembly requirements

Additional Notes:

  1. Material Limitations: Metal printing (e.g., SLM, EBM) is suitable for high-performance RF parts; ceramic printing is ideal for high-frequency and high-temperature scenarios; polymer printing is mostly used for prototypes and enclosures.
  2. Application Trends: Direct manufacturing is gradually replacing some traditional processes (e.g., integrated antenna printing), but large-scale production is still limited by cost and efficiency.
  3. Technical Direction: Multi-material printing (e.g., metal-ceramic composites) and micro/nano-scale printing are key future breakthroughs, applicable to terahertz communication and quantum communication devices.
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